IC chip kutadza kuongorora

IC chip kutadza kuongorora,ICchip integrated circuits haigoni kudzivisa kukundikana mukugadzirisa, kugadzira uye kushandiswa.Nekuvandudzwa kwezvinodiwa nevanhu zvemhando yechigadzirwa uye kuvimbika, kutadza kuongorora basa riri kuramba richinyanya kukosha.Kuburikidza nekuongorora kukundikana kwechip, IC chip yevagadziri vanogona kuwana kukanganisa mukugadzira, kusawirirana mune zvigadzirwa zvemagetsi, kugadzirwa kusina kunaka uye kushanda, nezvimwewo. Kukosha kwekukundikana kuongororwa kunonyanya kuratidzwa mu:

Muchidimbu, kukosha kukuru kweICchip kutadza kuongororwa kunoratidzwa mune zvinotevera zvinhu:

1. Kutadza kuongororwa inzira yakakosha uye nzira yekuona kutadza nzira yeIC chips.

2. Kuongororwa kwemhosho kunopa ruzivo rwakakosha rwekuongororwa kwemhosho kunobudirira.

3. Kutadza kuongororwa kunopa mainjiniya ekugadzira nekuenderera mberi kwekuvandudza uye kuvandudzwa kwechip dhizaini kuti isangane nezvinodiwa zvemagadzirirwo emhando.

4. Kutadza kuongororwa kunogona kuongorora kushanda kwemaitiro akasiyana ebvunzo, kupa zvinodikanwa zvekuyedzwa kwekugadzira, uye kupa ruzivo rwakakodzera rwekugadzirisa uye kuoneswa kwemaitiro ekuyedza.

Matanho makuru uye zviri mukati mekukundikana kuongororwa:

◆Integrated circuit unpacking: Paunenge uchibvisa dunhu rakabatanidzwa, chengetedza kutendeseka kwechiputi basa, chengetedza kufa, mabhondi, bondwires uye kunyange lead-frame, uye gadzirira chinotevera chip invalidation analysis experiment.

◆SEM scanning mirror/EDX composition analysis: material structure analysis/ defect observation, common micro-area analysis of element composition, chiyero chakarurama chekukura kwekuumbwa, nezvimwewo.

◆ Probe test: Chiratidzo chemagetsi mukati meICinogona kuwanikwa nekukurumidza uye nyore kuburikidza neiyo micro-probe.Laser: Micro-laser inoshandiswa kucheka iyo yepamusoro chaiyo nzvimbo yechip kana waya.

◆EMMI kuona: EMMI low-light microscope is high-effective fault analysis tool, iyo inopa hukuru hwekunzwa uye husingaparadzi nzvimbo yekukanganisa nzvimbo.Inogona kuona uye kuisa luminescence isina kusimba (inooneka uye iri padyo-infrared) uye inobata kubuda kwemhepo kunokonzerwa nekuremara uye anomalies muzvikamu zvakasiyana.

◆OBIRCH application (laser beam-induced impedance value change test): OBIRCH inowanzoshandiswa pakukwirira-impedance uye yakaderera-impedance kuongororwa mukati. ICmachipisi, uye mutsara kuvuza nzira yekuongorora.Uchishandisa nzira yeOBIRCH, kukanganisa mumaseketi kunogona kuwanikwa nenzira kwayo, senge maburi mumitsetse, maburi pasi nepamakomba, uye nzvimbo dzekupikisa dzakakwirira pazasi pemakomba.Mawedzero anotevera.

◆ LCD screen hot spot yekuona: Shandisa LCD skrini kuti uone kurongeka kwema molecular uye kuronga patsva panzvimbo yekudonha yeIC, uye ratidza mufananidzo wakaita ruvara rwakasiyana kubva kune dzimwe nzvimbo pasi pe microscope kuti uwane nzvimbo yekubuda (fault point yakakura kudarika). 10mA) izvo zvinonetsa mugadziri mukuongorora chaiko.Fixed-point/non-fixed-point chip grinding: bvisa mabumps egoridhe akaiswa paPad yeLCD driver chip, kuitira kuti Pad isakanganiswe zvachose, iyo inobatsira pakuongorora kunotevera uye kudzorera.

◆ X-Ray isiri-inoparadza bvunzo: Ona kwakasiyana zvikanganiso mukati ICchip packaging, senge peeling, kuputika, voids, wiring kutendeseka, PCB inogona kunge iine zvimwe zvakakanganisika mukugadzira maitiro, senge kurongeka kwakashata kana bhiriji, rakavhurika redunhu, pfupi dunhu kana abnormality Kukanganisa mukubatana, kuvimbika kwemabhora anotengeswa mumapakeji.

◆SAM (SAT) ultrasonic chikanganiso chekuona chinogona kusaparadza kuona chimiro mukati meICchip package, uye kunyatsoona kukuvadza kwakasiyana kunokonzerwa nehunyoro uye kupisa kwesimba, senge O wafer surface delamination, O solder mabhora, wafers kana mafirita Pane mapeji mumidziyo yekurongedza, pores mukati mekutakura zvinhu, maburi akasiyana senge wafer bonding nzvimbo. , solder mabhora, fillers, etc.