Tsigira BOM XCZU4CG-2SFVC784E munda programmable gedhi array yepakutanga Recyclable IC SOC CORTEX-A53 784FCBGA
Product Attributes
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Mfr | AMD Xilinx |
Series | Zynq® UltraScale+™ MPSoC CG |
Package | Tray |
Standard Package | 1 |
Product Status | Active |
Architecture | MCU, FPGA |
Core processor | Dual ARM® Cortex®-A53 MPCore™ ine CoreSight™, Dual ARM®Cortex™-R5 ine CoreSight™. |
Flash Size | - |
RAM Saizi | 256KB |
Peripherals | DMA, WDT |
Kubatana | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 533MHz, 1.3GHz |
Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Operating Temperature | 0°C ~ 100°C (TJ) |
Package / Nyaya | 784-BFBGA, FCBGA |
Supplier Device Package | 784-FCBGA (23×23) |
Nhamba yeI/O | 252 |
Base Product Number | XCZU4 |
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Uye zvakare, Infineon, NXP nekuda kwekukanganisa kweUnited States super cold wave, iyo chip fekitori iri muAustin, Texas, kupedzisa kudzima;iyo Renesas Electronics Naka fekitari (Hitachi Naka Guta, Ibaraki Prefecture, Japan) moto wakakonzera kukanganisa kwakakomba kunzvimbo yakakuvadzwa ndeye 12-inch high-end semiconductor wafer production line, iyo huru yekugadzira microprocessors kudzora kutyaira motokari.Zvinofungidzirwa kuti zvinogona kutora mazuva 100 kuti chip inobuda idzoke kune pre-fire level.