XC7Z030-2FFG676I - Integrated Circuits (ICs), Yakaiswa, System On Chip (SoC)
Product Attributes
TYPE | DESCRIPTION |
Category | Integrated Circuits (ICs) |
Mfr | AMD |
Series | Zynq®-7000 |
Package | Tray |
Product Status | Active |
Architecture | MCU, FPGA |
Core processor | Dual ARM® Cortex®-A9 MPCore™ ine CoreSight™ |
Flash Size | - |
RAM Saizi | 256KB |
Peripherals | DMA |
Kubatana | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed | 800MHz |
Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Nyaya | 676-BBGA, FCBGA |
Supplier Device Package | 676-FCBGA (27x27) |
Nhamba yeI/O | 130 |
Base Product Number | XC7Z030 |
Zvinyorwa & Media
RESOURCE TYPE | LINK |
Datasheets | Zynq-7000 All Programmable SoC Overview |
Product Training Modules | Powering Series 7 Xilinx FPGAs ine TI Power Management Solutions |
Ruzivo Rwezvakatipoteredza | Xiliinx RoHS Cert |
Featured Product | Zvese Programmable Zynq®-7000 SoC |
PCN Dhizaini/Kutsanangurwa | Mult Dev Material Chg 16/Dec/2019 |
Errata | Zynq-7000 Errata |
Environmental & Export Classifications
ATTRIBUTE | DESCRIPTION |
RoHS Status | ROHS3 Inoenderana |
Moisture Sensitivity Level (MSL) | 4 (72 Maawa) |
REACH Status | SIKIRA Usina Kubatwa |
ECCN | 3A991D |
HTSUS | 8542.39.0001 |
Chishandiso processor Unit (APU)
Izvo zvakakosha zveiyo APU zvinosanganisira:
• Dual-core kana single-core ARM Cortex-A9 MPCores.Zvimiro zvakabatana nechero core zvinosanganisira:
• 2.5 DMIPS/MHz
• Operating frequency range:
- Z-7007S/Z-7012S/Z-7014S (wire bond): Kusvikira 667 MHz (-1);766 MHz (-2)
- Z-7010/Z-7015/Z-7020 (wire bond): Kusvikira 667 MHz (-1);766 MHz (-2);866 MHz (-3)
- Z-7030/Z-7035/Z-7045 (flip-chip): 667 MHz (-1);800 MHz (-2);1GHz (-3)
- Z-7100 (flip-chip): 667 MHz (-1);800 MHz (-2)
• Kugona kushanda mune imwechete processor, symmetric dual processor, uye asymmetric dual processor modes.
• Single uye kaviri chaiyo chaiyo inoyangarara nzvimbo: kusvika 2.0 MFLOPS/MHz imwe neimwe
• NEON midhiya yekugadzirisa injini yeSIMD tsigiro
• Thumb®-2 tsigiro yekodhi compression
• Level 1 cache (yakasiyana mirairo uye data, 32 KB imwe neimwe)
- 4-nzira set-associative
- Non-blocking data cache nerutsigiro rwekusvika mana akasarudzika ekuverenga nekunyora anopotsa imwe neimwe
• Integrated memory management unit (MMU)
• TrustZone® kuitira kuchengetedza maitiro ekushanda
• Accelerator coherency port (ACP) interface inogonesa kupinda kwakabatana kubva kuPL kuenda kuCPU memory space
• Yakabatana Level 2 cache (512 KB)
• 8-nzira set-associative
• TrustZone yakagoneswa kuti ishande yakachengeteka
• Dual-ported, on-chip RAM (256 KB)
• Kusvikika neCPU uye programmable logic (PL)
• Yakagadzirirwa yakaderera latency kuwana kubva CPU
• 8-chiteshi DMA
• Inotsigira marudzi akawanda ekutamisa: memory-to-memory, memory-to-peripheral, peripheral-to-memory, uye kuparadzira-kuunganidza.
• 64-bit AXI interface, inogonesa yakakwira throughput DMA kutamiswa
• 4 nzira dzakatsaurirwa kuPL
• TrustZone yakagoneswa kuti ishande yakachengeteka
• Nzvimbo mbiri dzekuwana rejista dzinosimbisa kupatsanurwa pakati penzvimbo dzakachengeteka uye dzisina kuchengetedzwa
• Kuvhiringidza uye Kuchengeta nguva
• General interrupt controller (GIC)
• Imbwa nhatu dzenguva (WDT) (imwe paCPU uye imwe system WDT)
• Zvibatiso zvenguva kaviri/makaunda (TTC)
• CoreSight debug uye kutsvaga rutsigiro rweCortex-A9
• Chirongwa chekutsvaga macrocell (PTM) chekuraira uye kutsvaga
• Cross trigger interface (CTI) inogonesa hardware breakpoints uye zvinokonzeresa