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Chitsva chechokwadi chechokwadi chepakutanga IC stock Yemagetsi Zvikamu Ic Chip Tsigiro BOM Service TPS22965TDSGRQ1

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Product Detail

Product Tags

Product Attributes

TYPE DESCRIPTION
Category Integrated Circuits (ICs)

Power Management (PMIC)

Power Distribution Swichi, Rodha Vatyairi

Mfr Texas Instruments
Series Motokari, AEC-Q100
Package Tepi & Reel (TR)

Cheka Tape (CT)

Digi-Reel®

Product Status Active
Chinja Type General Chinangwa
Nhamba Yezvinobuda 1
Reshiyo - Input:Output 1:1
Output Configuration High Side
Output Type N-Channel
Interface On/Kudzima
Voltage - Kutakura 2.5V ~ 5.5V
Voltage - Supply (Vcc/Vdd) 0.8V ~ 5.5V
Zvazvino - Kubuda (Max) 4A
Rds On (Typ) 16mOhm
Input Type Kwete-Inverting
Features Kuburitsa Mutoro, Slew Rate Inodzorwa
Mhosva Dziviriro -
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Supplier Device Package 8-WSON (2x2)
Package / Nyaya 8-WFDFN Yakafumurwa Pad
Base Product Number TPS22965

 

Chii chinonzi kurongedza

Mushure mekuita kwenguva refu, kubva pakugadzira kusvika pakugadzira, iwe unozopedzisira wawana IC chip.Nekudaro, chip idiki uye nhete zvekuti inogona kukweshwa nekukuvadzwa nyore kana isina kuchengetedzwa.Uyezve, nekuda kwehukuru hudiki hwechip, hazvisi nyore kuzviisa pabhodhi nemaoko pasina imba yakakura.

Naizvozvo, tsananguro yepakiti inotevera.

Kune marudzi maviri emapakeji, iyo DIP package, iyo inowanzo wanikwa mumatoyi emagetsi uye inoita kunge centipede mune nhema, uye BGA package, iyo inowanzo kuwanikwa kana uchitenga CPU mubhokisi.Dzimwe nzira dzekurongedza dzinosanganisira iyo PGA (Pin Grid Array; Pin Grid Array) yakashandiswa mukutanga maCPU kana yakagadziridzwa vhezheni yeDIP, iyo QFP (plastic square flat package).

Nekuti kune dzakawanda dzakasiyana nzira dzekurongedza, zvinotevera zvinotsanangura iyo DIP uye BGA mapakeji.

Traditional mapakeji akatsungirira kwemakore

Pasuru yekutanga kuunzwa ndeye Dual Inline Package (DIP).Sezvauri kuona kubva pamufananidzo uri pazasi, iyo IC chip mupakeji inotaridzika kunge dema centipede pasi pemutsara wepini, izvo zvinokatyamadza.Nekudaro, nekuti inonyanya kugadzirwa nepurasitiki, kupisa kwekupisa mhedzisiro hakuna kunaka uye haigone kuzadzisa zvinodiwa zvechizvino-zvinomhanyisa machipisi.Nechikonzero ichi, mazhinji maIC anoshandiswa mupakeji iyi machipisi anogara kwenguva refu, senge OP741 iri padhayagiramu pazasi, kana maICs asingade kumhanya zvakanyanya uye ane machipisi madiki ane mavias mashoma.

Iyo IC chip kuruboshwe ndiyo OP741, yakajairika voltage amplifier.

Iyo IC kuruboshwe ndeye OP741, yakajairika voltage amplifier.

Kana iri Ball Grid Array (BGA) package, idiki pane DIP package uye inogona kupinda nyore mumidziyo midiki.Mukuwedzera, nokuti mapini ari pasi pe chip, mamwe mapini esimbi anogona kugadziriswa kana achienzaniswa neDIP.Izvi zvinoita kuti ive yakanaka kune machipisi anoda huwandu hukuru hwevanobatika.Zvisinei, inodhura uye nzira yekubatanidza yakanyanya kuoma, saka inonyanya kushandiswa muzvigadzirwa zvepamusoro.


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