Yemagetsi ic chip Tsigira BOM Service TPS54560BDDAR mhando nyowani ic chips zvigadzirwa zvemagetsi
Product Attributes
| TYPE | DESCRIPTION |
| Category | Integrated Circuits (ICs) |
| Mfr | Texas Instruments |
| Series | Eco-Mode™ |
| Package | Tepi & Reel (TR) Cheka Tape (CT) Digi-Reel® |
| SPQ | 2500T&R |
| Product Status | Active |
| Basa | Nhanho-Pasi |
| Output Configuration | Positive |
| Topology | Buck, Split Rail |
| Output Type | Adjustable |
| Nhamba Yezvinobuda | 1 |
| Voltage - Input (Mini) | 4.5V |
| Voltage - Input (Max) | 60V |
| Voltage - Kubuda (Mini/Yakagadziriswa) | 0.8V |
| Voltage - Kubuda (Max) | 58.8V |
| Zvazvino - Output | 5A |
| Frequency - Kuchinja | 500kHz |
| Synchronous Rectifier | No |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Nyaya | 8-PowerSOIC (0.154", 3.90mm Upamhi) |
| Supplier Device Package | 8-SO PowerPad |
| Base Product Number | TPS54560 |
1.IC zita, pasuru yeruzivo rwese uye yekupa mazita:
Tembiricha range.
C=0°C kusvika 60°C (giredhi rekutengesa);I=-20°C kusvika 85°C (giredhi remaindasitiri);E=-40°C kusvika 85°C (yakawedzerwa maindasitiri giredhi);A=-40°C kusvika 82°C (giredhi remuchadenga);M=-55°C kusvika 125°C (giredhi remauto)
Package type.
A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic mhangura pamusoro;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-Narrow DIP;N-DIP;Q PLCC;R - Narrow Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Wide Diki Form Factor (300mil) W-Wide diki fomu factor (300 mil);X-SC-60 (3P, 5P, 6P);Y-Narrow mhangura pamusoro;Z-TO-92, MQUAD;D-Die;/ PR-Yakasimbiswa plastiki;/W-Wafer.
Nhamba yemapini:
a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;i -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (kutenderera);W-10 (kutenderera);X-36;Y-8 (kutenderera);Z-10 (kutenderera).(kutenderera).
Ongorora: Tsamba yekutanga yemavara mana suffix yekirasi interface ndeye E, zvinoreva kuti mudziyo une antistatic basa.
2.Kuvandudzwa kwepakiti tekinoroji
Masekete ekutanga akabatanidzwa akashandisa ceramic flat package, iyo yakaramba ichishandiswa nemauto kwemakore mazhinji nekuda kwekuvimbika kwavo uye hukuru hudiki.Commercial circuit packaging yakakurumidza kuchinjika kuita mbiri-mu-mutsara mapakeji, kutanga neceramic kozoti epurasitiki, uye muma1980 nhamba yepini yemaseketi eVLSI yakapfuura miganho yekushandisa yemapakeji eDIP, zvichizotungamira mukubuda kwepini grid arrays uye chip vatakuri.
Iyo yepamusoro Mount package yakabuda mukutanga 1980s uye yakave yakakurumbira muchikamu chekupedzisira chemakore gumi iwayo.Inoshandisa pini yakatsetseka uye ine gull-wing kana J-shaped pini chimiro.Iyo Diki-Outline Integrated Circuit (SOIC), semuenzaniso, ine 30-50% yakaderera nzvimbo uye i70% yakaderera gobvu pane yakaenzana DIP.Pasuru iyi ine mapini akaita segull-mapapiro anobuda kubva kumativi maviri marefu uye pini yepini ye0.05".
Diki-Outline Integrated Circuit (SOIC) uye PLCC mapakeji.mu1990s, kunyangwe iyo PGA package yaive ichiri kushandiswa kwepamusoro-kuguma microprocessors.iyo PQFP uye yakaonda diki-pasuru-pasuru (TSOP) yakava yakajairwa pasuru yeakakwira pini kuverenga zvishandiso.Intel uye AMD's high-end microprocessors yakatama kubva kuPGA (Pine Grid Array) mapakeji kuenda kuLand Grid Array (LGA) mapakeji.
Ball Grid Array mapakeji akatanga kuoneka kuma1970, uye muma1990 FCBGA package yakagadziridzwa ine pini yepamusoro kupfuura mamwe mapasuru.Mupakeji yeFCBGA, dhidhi rinopetwa kumusoro nekudzika uye rakabatana nemabhora ekutengesa pasuru nePCB-yakafanana nebhesi layer kwete waya.Mumusika wemazuva ano, iyo yekurongedza zvakare ikozvino chikamu chakasiyana chemaitiro, uye tekinoroji yepakeji inogona kukanganisa kunaka uye goho rechigadzirwa.
