Nhanganyaya kune wafer Back Grinding process
1. Chinangwa cheBack Grinding
Mukugadzira semiconductors kubva kune wafers, kutaridzika kwewaferi kunogara kuchichinja.Kutanga, mukugadzirwa kwechifukidziro, Edge uye pamusoro pechifukidzo zvakasvibiswa, maitiro anowanzo kugaya mativi ose emucheka.Mushure mekupera kwekutanga-yekupedzisira maitiro, unogona kutanga kuseri kwekugaya nzira inongokuya kumashure kwechingwa, iyo inogona kubvisa kusvibiswa kwemakemikari pamberi-yekupedzisira maitiro uye kuderedza ukobvu hwechip, iyo yakakodzera kwazvo. yekugadzira machipisi matete akaiswa paIC makadhi kana nharembozha.Mukuwedzera, iyi nzira ine zvakanakira kuderedza kushorwa, kuderedza kushandiswa kwesimba, kuwedzera kupisa conductivity uye kukurumidza kubvisa kupisa kuseri kwechifukidziro.Asi panguva imwecheteyo, nekuti jira rakatetepa, zviri nyore kuputswa kana kutenderedzwa nemasimba ekunze, zvichiita kuti danho rekugadzirisa rive rakaoma.
2. Back Kukuya (Back Kukuya) zvakadzama maitiro
Kukuya kumashure kunogona kukamurwa kuita matanho matatu anotevera: kutanga, namira kudzivirira Tape Lamination pane chimedu;Chechipiri, fura shure kwechingwa;Chechitatu, usati waparadzanisa chip kubva kuWafer, wafer inoda kuiswa paWafer Mounting inodzivirira tepi.Iyo wafer patch process ndiyo nhanho yekugadzirira yekuparadzanisa iyochip(kucheka chip) uye naizvozvo inogonawo kuiswa mukucheka.Mumakore achangopfuura, sezvo machipisi ave kutetepa, kutevedzana kwemaitiro kunogona kuchinjawo, uye matanho ekuita ave akanyanya kunatswa.
3. Tape Lamination muitiro nokuda chitete kudzivirira
Nhanho yekutanga mukukuya kumashure ndeyekupfeka.Iyi inzira yekupfekedza inonamira tepi kumberi kwechingwa.Paunenge uchikuya kumusana, masikirwo esilicon achapararira kumativi ose, uye chidimbu chinogonawo kutsemuka kana kuputika nekuda kwemasimba ekunze panguva iyi, uye nzvimbo yakakura yewafer, inonyanya kubatwa nechiitiko ichi.Naizvozvo, usati wakuya musana, firimu rakatetepa reUltra Violet (UV) rebhuruu rinosungirirwa kuchengetedza wafer.
Paunenge uchiisa firimu, kuitira kuti usaite gaka kana mabhubhu emhepo pakati pechifukidzo uye tepi, zvakakosha kuwedzera simba rekunamatira.Zvisinei, mushure mekugaya kumusana, tepi pamucheka inofanira kupiswa ne ultraviolet chiedza kuderedza simba rekunamatira.Mushure mekubvisa, tepi inosara haifanirwe kuramba iri pawafer pamusoro.Dzimwe nguva, maitiro acho achashandisa isina kusimba adhesion uye anowanzoita bubble isiri-ultraviolet inoderedza membrane kurapwa, kunyangwe zvakawanda zvakaipira, asi zvisingadhure.Uye zvakare, maBump mafirimu, ayo akakora zvakapetwa kaviri seUV ekuderedza membrane, anoshandiswawo, uye anotarisirwa kushandiswa nekuwedzera frequency mune ramangwana.
4. Ukobvu hwewafer hunopesana nechippakeji
Wafer ukobvu mushure mekukuya kumashure kunowanzo kuderedzwa kubva pa800-700 µm kusvika 80-70 µm.Mawafer akatetepa kusvika pachikamu chegumi anogona kurongedza mana kusvika matanhatu.Munguva ichangopfuura, mawafer anogona kutetepa kusvika pamamirimita makumi maviri nekuita maviri-kugaya, nokudaro achiaisa kune gumi nematanhatu kusvika 32 akaturikidzana, akawanda-layer semiconductor chimiro chinozivikanwa semulti-chip package (MCP).Muchiitiko ichi, zvisinei nekushandiswa kwematanho akawanda, hurefu hwakazara hwepakeji yakapedzwa haifanire kudarika humwe ukobvu, ndosaka zvitete zvitete zvinogaya zvinoteedzerwa.Iyo yakatetepa iyo yakapfava, iyo yakawanda inorema iripo, uye zvakanyanya kuoma nzira inotevera.Naizvozvo, tekinoroji yepamusoro inodiwa kugadzirisa dambudziko iri.
5. Kuchinja kwemashure ekukuya nzira
Nekucheka mawafers akatetepa sezvinobvira kuti akunde zvisingakwanisi kugadzirisa matekinoroji, kuseri kwekukuya tekinoroji inoramba ichishanduka.Pamawafer akajairika ane ukobvu hwemakumi mashanu kana kupfuura, Kukuya kumashure kunosanganisira matanho matatu: Rough Kukuya kozoti Fine Grinding, apo chitete chinochekwa nekukwenenzverwa mushure mezvikamu zviviri zvekukuya.Panguva ino, yakafanana neChemical Mechanical Polishing (CMP), Slurry uye Deionized Mvura inowanzoiswa pakati peporizha pad newafer.Iri basa rekupukuta rinogona kuderedza kukweshana pakati pewafer nepedhi yekupolisha, uye kuita kuti nzvimbo yacho ive yakajeka.Kana jira racho ranyanya kukora, Super Fine Grinding inogona kushandiswa, asi iyo yakatetepa, ndipo painodiwa kukwenenzvera.
Kana iyo yakapfava ikava yakaonda, inotarisana nekuremara kwekunze panguva yekucheka.Naizvozvo, kana ukobvu hwewafer huri 50 µm kana pasi, kutevedzana kwemaitiro kunogona kuchinjwa.Panguva ino, nzira yeDBG (Dicing Before Grinding) inoshandiswa, kureva kuti, chidimbu chinochekwa nehafu isati yatanga kugaya.Iyo chip inopatsanurwa zvakachengeteka kubva pawafer muhurongwa hweDicing, kugaya, uye kucheka.Mukuwedzera, kune nzira dzakakosha dzekukuya dzinoshandisa ndiro yakasimba yegirazi kudzivirira kuti chiputi chisaputsika.
Nekuwedzera kuri kuita kudiwa kwekubatanidzwa mune miniaturization yemidziyo yemagetsi, kuseri kwekukuya tekinoroji haifanire kungokunda zvisingakwanisi, asi zvakare kuramba ichikura.Panguva imwecheteyo, hazvidikanwi chete kugadzirisa dambudziko rekuremara kwechifukidziro, asiwo kugadzirira matambudziko matsva anogona kubuda mune ramangwana.Kuti ugadzirise matambudziko aya, zvingave zvakakoshachinjakutevedzana kwemaitiro, kana kuunza makemikari etching tekinoroji inoshandiswa kunesemiconductorkumberi-kumagumo maitiro, uye kukudziridza zvizere nzira itsva dzekugadzirisa.Kuti ugadzirise kukanganisa kwakazvarwa kwenzvimbo dzakakura-nzvimbo, nzira dzakasiyana-siyana dzekukuya dziri kuongororwa.Pamusoro pezvo, tsvakiridzo iri kuitwa pamusoro pekuti ungadzokorodza sei silicon slag inogadzirwa mushure mekukuya mawafer.
Nguva yekutumira: Jul-14-2023