Yekutanga IC XCKU025-1FFVA1156I Chip Yakabatanidzwa Circuit IC FPGA 312 I/O 1156FCBGA

Yekutanga IC XCKU025-1FFVA1156I Chip Integrated Circuit IC FPGA 312 I/O 1156FCBGA Featured Image

tsananguro pfupi:

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA、FCBGA

Tumira email kwatiri Dhawunirodha Datesheet

Product Detail

Product Tags

Product Attributes

TYPE	Enzanisirai
category	Integrated Circuits (ICs) Embedded Field Programmable Gate Arrays (FPGAs)
mugadziri	AMD
series	Kintex® UltraScale™
wrap	zvakawanda
Chigadzirwa chimiro	Active
DigiKey inogoneka	Hazvina kusimbiswa
LAB/CLB nhamba	18180
Nhamba yezvinhu zvine musoro/mayuniti	318150
Nhamba yese ye RAM bits	13004800
Nhamba yeI/Os	312
Voltage - Simba rekupa	0.922V ~ 0.979V
Kuiswa mhando	Surface adhesive type
Kushanda tembiricha	-40°C ~ 100°C (TJ)
Package/Housing	1156-BBGA,FCBGA
Mutengesi chikamu encapsulation	1156-FCBGA (35x35)
Product master number	XCKU025

Zvinyorwa & Media

RESOURCE TYPE	LINK
Datasheet	Kintex® UltraScale™ FPGA Datasheet
Ruzivo rwezvakatipoteredza	Xiliinx RoHS Cert Xilinx REACH211 Cert
PCN dhizaini/kutsanangurwa	Ultrascale & Virtex Dev Spec Chg 20/Dec/2016

Kurongeka kwezvakatipoteredza uye zvekunze zvakatemwa

ATTRIBUTE	Enzanisirai
RoHS chimiro	Inoenderana neiyo ROHS3 rairo
Humidity Sensitivity Level (MSL)	4 (72 maawa)
SVITSA chimiro	Kwete pasi pe REACH yakatarwa
ECCN	3A991D
HTSUS	8542.39.0001

Product Sumo

FCBGA(Flip Chip Ball Grid Array) inomirira "flip chip ball grid Array".

FC-BGA (Flip Chip Bhora Grid Array), inodaidzwa kuti flip chip bhora grid array package fomati, zvakare ndiyo yakakosha pasuru fomati yemifananidzo yekumhanyisa machipisi parizvino.Iyi tekinoroji yekurongedza yakatanga muna 1960s, apo IBM yakagadzira iyo inodaidzwa kuti C4(Controlled Collapse Chip Connection) tekinoroji yekuunganidza makomputa makuru, uyezve yakagadziridzwa kushandisa tension yepasi yebulge yakanyungudutswa kutsigira huremu hwechip. uye kudzora kukwirira kwebulge.Uye uve nzira yekuvandudza yeflip tekinoroji.

Ndezvipi zvakanakira FC-BGA?

Kutanga, inogadzirisaelectromagnetic kuenderana(EMC) uyeelectromagnetic interference (EMI)matambudziko.Kazhinji kutaura, iyo chiratidzo chekufambisa chip uchishandisa WireBond yekurongedza tekinoroji inoitwa kuburikidza nesimbi waya ine humwe hurefu.Muchiitiko chepamusoro-soro, nzira iyi ichabudisa iyo inonzi impedance effect, ichigadzira chipingamupinyi panzira yechiratidzo.Nekudaro, FC-BGA inoshandisa pellets pachinzvimbo chepini kubatanidza processor.Pasuru iyi inoshandisa mabhora e479, asi imwe neimwe ine dhayamita ye0.78 mm, iyo inopa ipfupi yekunze yekubatanidza chinhambwe.Kushandisa pasuru iyi hakungope kuita kwakanakisa kwemagetsi, asi zvakare kunoderedza kurasikirwa uye inductance pakati pechinhu chinopindirana, kunoderedza dambudziko rekukanganiswa kwemagetsi, uye inogona kumira mafrequency epamusoro, kutyora muganho weoverclocking kunogoneka.

Chechipiri, sezvo vagadziri vezviratidzi vanonyudza maseketi akawanda uye akanyanya kusimba munzvimbo imwechete yesilicon crystal, nhamba yekupinza uye yekuburitsa zviteshi nemapini ichawedzera nekukurumidza, uye imwe mukana weFC-BGA ndeyekuti inogona kuwedzera density yeI / O. .Kazhinji kutaura, iyo I/O inotungamira ichishandisa WireBond tekinoroji yakarongedzerwa kutenderedza chip, asi mushure meFC-BGA package, iyo I/O inotungamira inogona kurongeka muhurongwa pamusoro peiyo chip, ichipa yakakwira density I/O. marongerwo, zvichikonzera kushandiswa kwakanakisa kwekushandisa, uye nekuda kweiyi mukana.Inversion tekinoroji inodzikisa nzvimbo ne30% kusvika 60% zvichienzaniswa nemafomu ekurongedza echinyakare.

Pakupedzisira, muchizvarwa chitsva chepamusoro-speed, yakanyatsobatanidzwa kuratidza machipisi, dambudziko rekupisa kupisa richava dambudziko guru.Zvichienderana neyakasiyana flip package fomu yeFC-BGA, kuseri kwechip kunogona kuratidzwa kumhepo uye kunogona kuburitsa kupisa zvakananga.Panguva imwecheteyo, iyo substrate inogonawo kuvandudza kupisa kwekushisa kwekushisa kuburikidza nesimbi yesimbi, kana kuisa sink yesimbi yekupisa kuseri kwechiputi, inowedzera kusimbisa kukwanisa kupisa kwechiputi, uye kuvandudza zvakanyanya kugadzikana kwechip. pakushanda kwepamusoro-soro.

Nekuda kwemabhenefiti eFC-BGA package, angangoita ese magiraidhi ekumhanyisa kadhi machipisi akaiswa neFC-BGA.

Zvakapfuura: XC7VX485T-2FFG1761I Virtex®-7 T uye XT FPGAs inowanikwa mu -3, -2, -1, uye -2L kumhanya mamakisi RoHS Inowirirana

Zvinotevera: XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104

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