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Yekutanga MuStock Yakabatanidzwa Circuit XC3S200-4PQG208C XC6VSX315T-2FFG1156I XC9572XL-10VQ64C XC6SLX252CSG324C Ic Chip

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Product Detail

Product Tags

Product Attributes

TYPE DESCRIPTION

SARUDZA

Category Integrated Circuits (ICs)Embedded

FPGAs (Field Programmable Gate Array)

 

 

 

Mfr AMD

 

Series Virtex®-6 SXT

 

Package Tray

 

Product Status Active

 

Nhamba yeLABs/CLBs 24600

 

Nhamba yeLogic Elements/Masero 314880

 

Yese RAM Bits 25952256

 

Nhamba yeI/O 600

 

Voltage - Supply 0.95V ~ 1.05V

 

Mounting Type Surface Mount

 

Operating Temperature -40°C ~ 100°C (TJ)

 

Package / Nyaya 1156-BBGA, FCBGA

 

Supplier Device Package 1156-FCBGA (35×35)

 

Base Product Number XC6VSX315  

 Zvinyorwa & Media

RESOURCE TYPE LINK
Datasheets Virtex-6 FPGA DatasheetVirtex-6 FPGA Family Overview
Product Training Modules Virtex-6 FPGA Overview
Ruzivo Rwezvakatipoteredza Xiliinx RoHS CertXilinx REACH211 Cert
PCN Dhizaini/Kutsanangurwa Mult Dev Material Chg 16/Dec/2019

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Inoenderana
Moisture Sensitivity Level (MSL) 4 (72 Maawa)
REACH Status SIKIRA Usina Kubatwa
ECCN 3A991D
HTSUS 8542.39.0001

 Integrated Circuits

An integrated circuit (IC) is semiconductor chip inotakura zvinhu zvidiki zvidiki senge capacitor, diodes, transistors, uye resistors.Aya madiki madiki anoshandiswa kuverenga nekuchengetedza data nerubatsiro rwedhijitari kana analogi tekinoroji.Iwe unogona kufunga nezve IC sediki chip inogona kushandiswa seyakazara, yakavimbika dunhu.Maseketi akabatanidzwa anogona kunge ari counter, oscillator, amplifier, logic gedhi, timer, komputa memory, kana kunyange microprocessor.

IC inoonekwa sechinhu chakakosha chekuvaka chemidziyo yese yemagetsi yanhasi.Iro zita rinoratidza sisitimu yezvakawanda zvakabatanidzwa zvikamu zvakanyudzwa mutete, silicon-yakagadzirwa semiconductor zvinhu.

Nhoroondo yeIntegrated Circuits

Tekinoroji yekuseri kwemasekete akabatanidzwa yakatanga kuunzwa muna 1950 naRobert Noyce naJack Kilby muUnited States of America.US Air Force ndiyo yaive yekutanga mutengi wechigadzirwa chitsva ichi.Jack zvakare Kilby akaenderera mberi nekuhwina Mubairo weNobel muFizikisi muna 2000 nekugadzira kwake miniaturized ICs.

Makore 1.5 mushure mekuiswa kwedhizaini yaKilby, Robert Noyce akaunza vhezheni yake yedunhu rakasanganiswa.Muenzaniso wake wakagadzirisa nyaya dzinoverengeka dzinoshanda mumudziyo waKilby.Noyce akashandisawo silicon kumuenzaniso wake, nepo Jack Kilby akashandisa germanium.

Robert Noyce naJack Kilby vese vakawana marezenisi eUS pamupiro wavo kumasekete akabatanidzwa.Vakatambura nenyaya dzemutemo kwemakore akati kuti.Pakupedzisira, makambani eNoyce neKilby akafunga kuyambuka-rezenisi zvavakagadzira uye kuvasuma kumusika mukuru wepasirese.

Mhando dzeIntegrated Circuits

Kune marudzi maviri emasekete akabatanidzwa.Izvi ndezvi:

1. Analogi ICs

Analog ICs ane anogara achichinja kubuda, zvichienderana nechiratidzo chavari kuwana.Muchiono, maIC akadai anogona kuwana huwandu husingagumi hwematunhu.Mune rudzi urwu rweIC, iyo inobuda nhanho yekufamba ibasa remutsara weyero yekupinza yechiratidzo.

Linear ICs inogona kushanda seredhiyo-frequency (RF) uye audio-frequency (AF) amplifiers.Iyo yekushandisa amplifier (op-amp) ndicho chishandiso chinowanzo shandiswa pano.Uye zvakare, tembiricha sensor imwe yakajairika application.Linear ICs inogona kubatidza nekudzima zvishandiso zvakasiyana kana chiratidzo chasvika pane imwe kukosha.Iwe unogona kuwana iyi tekinoroji mumavheni, maheater, uye air conditioners.

2. Digital ICs

 Izvi zvakasiyana neanalogi ICs.Ivo havashande pamusoro penguva dzose yehuwandu hwechiratidzo chemazinga.Pane kudaro, vanoshanda pane mashoma pre-set mazinga.Digital ICs inonyanya kushanda nerubatsiro rwemagedhi anonzwisisika.Iwo logic magedhi anoshandisa binary data.Zviratidzo zviri mubhinari data zvine mazinga maviri chete anozivikanwa seakaderera (logic 0) uye yakakwirira (logic 1).

Digital ICs anoshandiswa mumhando dzakasiyana dzekushandisa senge makomputa, modem, nezvimwe.

Sei Integrated Circuits Yakakurumbira?

Kunyangwe yakagadzirwa makore angangoita makumi matatu apfuura, maseketi akasanganiswa achiri kushandiswa mune akawanda maapplication.Ngatikurukurei zvimwe zvezvinhu zvinokonzeresa mukurumbira wavo:

1.Scalability

Makore mashoma apfuura, mari yeindasitiri yesemiconductor yakasvika pamadhora mazana matatu nemakumi mashanu emadhora emadhora.Intel ndiye aive mupi mukuru apa.Paive nevamwe vatambi zvakare, uye mazhinji acho aive emusika wedhijitari.Kana iwe ukatarisa nhamba, iwe uchaona kuti 80 muzana yekutengesa yakagadzirwa neindasitiri yesemiconductor yaibva pamusika uyu.

Maseta akabatanidzwa akaita basa guru mukubudirira uku.Iwe unoona, vaongorori veindasitiri yesemiconductor vakaongorora dunhu rakasanganiswa, mashandisiro aro, uye maratidziro ayo uye akarikwidza kumusoro.

Yekutanga IC yakambogadzirwa yaingova nema transistors mashoma - 5 kuve akajeka.Uye ikozvino taona Intel's 18-core Xeon ine yakazara 5.5 bhiriyoni transistors.Uyezve, IBM's Storage Controller yaive ne7.1 bhiriyoni transistors ine 480 MB L4 cache muna 2015.

Uku scalability kwaita basa rakakura mukuzivikanwa kuriko kweIntegrated Circuits.

2. Mutengo

Pakave nemakakatanwa akati wandei pamutengo weIC.Kwemakore, pave paine kusanzwisisa nezvemutengo chaiwo weIC zvakare.Chikonzero chiri shure kweizvi ndechekuti ICs haisisiri pfungwa yakapusa zvakare.Tekinoroji iri kuenda kumberi nekumhanya kwakakura, uye vanogadzira chip vanofanirwa kufambirana nekumhanya uku pavanenge vachiverenga mutengo weIC.

Makore mashoma apfuura, mutengo wekuverenga weIC waishandiswa kuvimba nesilicon kufa.Panguva iyoyo, kufungidzira mutengo wechip waigona kutariswa zviri nyore nehukuru hwekufa.Nepo silicon ichiri chinhu chekutanga mukuverenga kwavo, nyanzvi dzinofanirwa kufunga nezve zvimwe zvikamu pakuverenga mutengo weIC, zvakare.

Parizvino, nyanzvi dzakatora equation iri nyore kuona mutengo wekupedzisira weIC:

Final IC Cost = Package Cost + Test Cost + Die Cost + Shipping Cost

Iyi equation inotarisa zvese zvinodiwa izvo zvinoita basa rakakura mukugadzira chip.Mukuwedzera kune izvozvo, panogona kuva nezvimwe zvinhu zvinogona kufungwa nezvazvo.Chinhu chakanyanya kukosha chekufunga kana uchifungidzira mitengo yeIC ndechekuti mutengo unogona kusiyanisa panguva yekugadzirwa kwezvikonzero zvakawanda.

Zvakare, chero sarudzo dzehunyanzvi dzakatorwa panguva yekugadzira dzinogona kuve nemhedzisiro yakakura pamutengo weprojekiti.

3. Kuvimbika

Kugadzirwa kwemasekete akabatanidzwa ibasa rinonetsa sezvo richida kuti masisitimu ese arambe achishanda mukati memamiriyoni ematenderedzwa.Ekunze magetsi emagetsi minda, tembiricha yakanyanyisa, uye mamwe mamiriro ekushanda ese anoita basa rakakosha mukushanda kweIC.

Nekudaro, mazhinji enyaya idzi anobviswa nekushandiswa kwakanyatso kudzora-kushushikana kuyedzwa.Iyo inopa hapana mitsva yekukundikana maitiro, kuwedzera kuvimbika kwemasekete akabatanidzwa.Isu tinogona zvakare kuona kutadza kugoverwa munguva pfupi pfupi kuburikidza nekushandiswa kwepamusoro kudzvinyirira.

Zvese izvi zvinhu zvinobatsira kuve nechokwadi chekuti dunhu rakasanganiswa rinokwanisa kushanda nemazvo.

Uyezve, heano mamwe maitiro ekuona maitiro emasekete akabatanidzwa:

Tembiricha

Tembiricha inogona kusiyana zvakanyanya, zvichiita kuti kugadzirwa kweIC kuome zvakanyanya.

Voltage.

Midziyo inoshanda pane inomina voltage iyo inogona kusiyanisa zvishoma.

Process

Iwo akanyanya kukosha maitiro akasiyana anoshandiswa kumidziyo ndeye threshold voltage uye urefu hwechiteshi.Maitiro akasiyana anorongerwa se:

  • Zvakawanda kune zvakawanda
  • Wafer kune wafer
  • Kufa kufa

Integrated Circuit Packages

Iyo pasuru inoputira iyo inofa yedunhu rakasanganiswa, zvichiita kuti zvive nyore kwatiri kuti tibatanidze kwairi.Imwe neimwe yekunze inobatana padhizi inobatanidzwa nekadiki kewaya yegoridhe kune pini pasuru.Mapini ari extruding terminals ari sirivheri muruvara.Vanopfuura nepakati pedunhu kuti vabatane nezvimwe zvikamu zvechip.Izvi zvakakosha zvakanyanya sezvo zvichitenderera dunhu uye kubatanidza kune waya uye zvimwe zvikamu mudunhu.

Kune akati wandei akasiyana marudzi emapakeji anogona kushandiswa pano.Ese ane akasiyana emhando yekumisikidza, akasiyana zviyero, uye pini kuverenga.Ngatitarisei kuti izvi zvinoshanda sei.

Pin Counting

Yese maseketi akabatanidzwa ane polarized, uye pini imwe neimwe yakasiyana maererano nezvose zviri zviviri basa uye nzvimbo.Izvi zvinoreva kuti pasuru inoda kuratidza uye kuparadzanisa mapini kubva kune mumwe nemumwe.MaIC akawanda anoshandisa dot kana notch kuratidza pini yekutanga.

Kana iwe uchinge waziva nzvimbo yepini yekutanga, dzimwe nhamba dzepini dzinowedzera mukutevedzana paunenge uchienda kupokana-wachi kutenderera dunhu.

Mounting

Kukwirisa ndeimwe yeakasarudzika maitiro emhando yepasuru.Ese mapakeji anogona kukamurwa seimwe yemhando mbiri dzinokwira: pamusoro-gomo (SMD kana SMT) kana kuburikidza-gomba (PTH).Zviri nyore kushanda neKuburikidza-gomba mapakeji sezvo ari makuru.Izvo zvakagadzirirwa kugadziriswa kune rumwe rutivi rwedunhu uye kutengeswa kune imwe.

Surface-mount packages inouya muhukuru hwakasiyana, kubva kudiki kusvika kune minuscule.Izvo zvakagadziriswa kune rumwe rutivi rwebhokisi uye zvinotengeswa kumusoro.Mapini epakeji iyi anogona kunge ari perpendicular kune chip, akadzvanywa padivi, kana dzimwe nguva akaiswa mune matrix pazasi pechip.Masekete akabatanidzwa muchimiro chepamusoro-gomo anodawo maturusi akakosha kuti aunganidzwe.

Dual In-Line

Dual In-line Package (DIP) ndeimwe yemapakeji akajairika.Iyi imhando yekupfuura-gomba IC package.Aya machipisi madiki ane mitsara miviri yakaenzana yepini inotambanuka kubva mutema, purasitiki, rectangular imba.

Mapini ane nzvimbo inosvika 2.54 mm pakati pawo - mwero wakakwana kuti ukwane mumapuranga echingwa uye mamwe mashoma eprototyping board.Zvichienderana nehuwandu hwepini, iyo DIP package yakazara zviyero zvinogona kusiyana kubva pa4 kusvika 64.

Nharaunda iri pakati pemutsara wega wega wepini yakapatsanurwa kuitira kuti maDIP ICs apfuure nzvimbo yepakati pebhodhi rezvingwa.Izvi zvinova nechokwadi chekuti mapini ane mutsara wavo uye haana kupfupika.

Diki-Outline

Diki-outline yakabatanidzwa yedunhu mapakeji kana SOIC yakafanana neyepamusoro-gomo.Inogadzirwa nekukotamisa mapini ese paDIP nekuidzikisa pasi.Unogona kuunganidza mapakeji aya neruoko rwakatsiga uye kunyangwe ziso rakavharwa - Zviri nyore!

Quad Flat

Quad Flat mapakeji anoridza mapini mumativi mana ese.Nhamba yese yepini mu quad flat IC inogona kusiyana chero kubva pamapini masere padivi (32 yakazara) kusvika makumi manomwe pini padivi (300+ pamwe chete).Mapini aya ane nzvimbo inosvika 0.4mm kusvika 1mm pakati pawo.Zvidiki zvakasiyana zveiyo quad flat package ine yakaderera-mbiri (LQFP), yakaonda (TQFP), uye yakanyanya kutetepa (VQFP) mapakeji.

Ball Grid Arrays

Bhora Grid Arrays kana BGA ndiwo akanyanya advanced IC mapakeji akatenderedza.Aya akaomesesa zvinoshamisa, madiki mapakeji apo mabhora madiki e solder anogadzikwa mune maviri-dimensional grid pachigadziko chedunhu rakasanganiswa.Dzimwe nguva nyanzvi dzinobatanidza mabhora ekutengesa zvakananga kudhiya!

Ball Grid Arrays mapakeji anowanzo shandiswa kune epamberi microprocessors, seRaspberry Pi kana pcDuino.


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