XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
Product Information
| TYPENo.zveLogic Blocks: | 2586150 |
| Nhamba yeMacrocells: | 2586150Macrocells |
| FPGA Mhuri: | Virtex UltraScale Series |
| Logic Case Style: | FCBGA |
| Nhamba yePini: | 2104Pins |
| Nhamba yeMagiredhi ekumhanya: | 2 |
| Yese RAM Bits: | 77722Kbit |
| Nhamba yeI/O's: | 778I/O's |
| Kutarisira Wachi: | MMCM, PLL |
| Core Supply Voltage Min: | 922mV |
| Core Supply Voltage Max: | 979mV |
| I/O Supply Voltage: | 3.3V |
| Kushanda Frequency Max: | 725MHz |
| Product Range: | Virtex UltraScale XCVU9P |
| MSL: | - |
Product Sumo
BGA inomiriraBhora Grid Q Array Package.
Iyo ndangariro yakavharidzirwa neBGA tekinoroji inogona kuwedzera ndangariro huwandu kusvika katatu pasina kuchinja huwandu hwendangariro, BGA uye TSOP.
Kuenzaniswa ne, ine vhoriyamu diki, zvirinani kupisa kupisa kuita uye kushanda kwemagetsi.BGA kurongedza tekinoroji yakagadziridza zvakanyanya chengetedzo yekugona pa square inch, ichishandisa BGA yekurongedza tekinoroji ndangariro zvigadzirwa pasi pesimba rakafanana, vhoriyamu inongova chikamu chimwe chete muzvitatu cheTSOP kurongedza;Uyezve, netsika
Kuenzaniswa neTSOP package, iyo BGA package ine inokurumidza uye inoshanda zvakanyanya kupisa kupisa nzira.
Nekuvandudzwa kweiyo yakabatanidzwa tekinoroji tekinoroji, izvo zvekurongedza zvinodiwa zveakabatanidzwa maseketi zvakanyanya kuomarara.Izvi zvinodaro nekuti tekinoroji yekurongedza ine hukama nekushanda kwechigadzirwa, kana kuwanda kweIC kuchipfuura 100MHz, iyo yechinyakare yekurongedza nzira inogona kuburitsa iyo inonzi "Cross Talk• phenomenon, uye kana nhamba yepini yeIC iri. yakakura kupfuura 208 Pin, iyo yechinyakare yekurongedza nzira ine matambudziko ayo. Naizvozvo, pamusoro pekushandiswa kweQFP kurongedza, mazhinji emazuva ano epamusoro pini count machipisi (akadai semifananidzo machipisi uye chipsets, nezvimwewo) anochinjirwa kuBGA(Ball Grid Array. PackageQ) yekurongedza tekinoroji. BGA payakaonekwa, yakave sarudzo yakanakisa yemhando yepamusoro-density, yepamusoro-soro, akawanda-pini mapakeji akadai secpus uye maodzanyemba/North bhiriji machipisi pamabhodhi eamai.
BGA yekurongedza tekinoroji inogona zvakare kukamurwa muzvikamu zvishanu:
1.PBGA (Plasric BGA) substrate: Kazhinji 2-4 akaturikidzana organic zvinhu inoumbwa multi-layer board.Intel akatevedzana CPU, Pentium 1l
Chuan IV processors ese akaiswa mune iyi fomu.
2.CBGA (CeramicBCA) substrate: kureva, ceramic substrate, kubatanidza kwemagetsi pakati pechip uye substrate kunowanzo kuflip-chip.
Maitiro ekuisa FlipChip (FC kwenguva pfupi).Intel akatevedzana cpus, Pentium l, ll Pentium Pro processors anoshandiswa
Chimiro che encapsulation.
3.FCBGA(FilpChipBGA) substrate: Yakaoma yakawanda-yakapetwa substrate.
4.TBGA (TapeBGA) substrate: The substrate iri ribhoni nyoro 1-2 akaturikidzana PCB redunhu bhodhi.
5.CDPBGA (Carty Down PBGA) substrate: inoreva yakaderera sikweya chip nzvimbo (inozivikanwawo semhango nzvimbo) pakati pasuru.
BGA package ine zvinotevera maficha:
1) .10 Nhamba yepini inowedzera, asi kureba pakati pepini yakakura zvikuru kupfuura yeQFP packaging, iyo inovandudza goho.
2) .Kunyange zvazvo kushandiswa kwesimba kweBGA kuchiwedzerwa, kushandiswa kwemagetsi ekupisa kunogona kuvandudzwa nekuda kwekudzora kudonha chip welding nzira.
3).Iyo chiratidzo chekufambisa kunonoka idiki, uye iyo inogadziriswa frequency inovandudzwa zvakanyanya.
4).Gungano rinogona kuva coplanar welding, iyo inovandudza zvikuru kuvimbika.
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