Product Attributes

Intel inoburitsa 3D chip ruzivo: inokwanisa kurongedza mabhiriyoni zana transistors, inoronga kutanga muna 2023.

Iyo 3D yakaturikidzana chip ndiyo nzira itsva yeIntel yekupikisa Mutemo waMoore nekurongedza zvinhu zvine musoro muchip kuti iwedzere zvakanyanya kuwanda kweCPUs, GPUs, uye AI processors.Iine chip maitiro ari pedyo nekumira, iyi inogona kunge iri nzira yega yekuenderera mberi nekuvandudza mashandiro.

Munguva pfupi yapfuura, Intel yakaratidza hutsva hutsva hweiyo 3D Foveros chip dhizaini yeinouya Meteor Lake, Arrow Lake, uye Lunar Lake machipisi pamusangano weindasitiri wesemiconductor Hot Chips 34.

Runyerekupe ruchangoburwa rwakataura kuti Intel's Meteor Lake ichanonoka nekuda kwechido chekuchinja Intel's GPU tile/chipset kubva kuTSMC 3nm node kuenda ku5nm node.Nepo Intel isati yagovera ruzivo nezve iyo node chaiyo yaichashandisa kuGPU, mumiriri wekambani akati node yakarongwa yechikamu cheGPU haina kuchinja uye kuti processor iri munzira yekuburitswa-nguva muna 2023.

Zvikuru, panguva ino Intel inongoburitsa chimwe chezvikamu zvina (CPU chikamu) chinoshandiswa kuvaka machipisi ayo eMeteor Lake - TSMC ichaburitsa mamwe matatu.Maindasitiri masosi anoratidza kuti iyo GPU mataira ndeye TSMC N5 (5nm maitiro).

Intel yakagovera mifananidzo yazvino yeMeteor Lake processor, iyo inoshandisa Intel's 4 process node (7nm process) uye ichatanga yarova musika senge mobile processor ine matanhatu makuru cores uye maviri madiki cores.Iyo Meteor Lake uye Arrow Lake machipisi anovhara zvinodikanwa zvemafoni uye desktop PC misika, nepo Lunar Lake ichizoshandiswa mune matete uye akareruka manotsi mabhuku, anovhara 15W uye pazasi musika.

Kufambira mberi mukurongedza uye kuwirirana kuri kukurumidza kuchinja chiso chemazuva ano processors.Ose ari maviri ikozvino akakosha seyakadzika maitiro node tekinoroji - uye zvine nharo zvakanyanya kukosha mune dzimwe nzira.

Zvakawanda zvekuburitswa kweIntel nemusi weMuvhuro zvakatarisa kune yayo 3D Foveros yekurongedza tekinoroji, iyo ichashandiswa sehwaro hweMeteor Lake, Arrow Lake, uye Lunar Lake processors kumusika wevatengi.Iyi tekinoroji inobvumira Intel kudzika yakamira machipisi madiki pane yakabatana base chip ine Foveros inobatana.Intel iri kushandisawo Foveros kune yayo Ponte Vecchio uye Rialto Bridge GPUs uye Agilex FPGAs, saka inogona kutorwa seyakadzika tekinoroji kune akati wandei einotevera-chizvarwa zvigadzirwa zvekambani.

Intel yakambounza 3D Foveros kumusika pane yayo yakaderera-vhoriyamu Lakefield processors, asi iyo 4-tile Meteor Lake uye inoda kusvika makumi mashanu-tile Ponte Vecchio ndiwo machipisi ekambani ekutanga kugadzirwa nehunyanzvi.Mushure meArrow Lake, Intel ichachinja kuenda kune itsva UCI yekubatanidza, iyo inoibvumira kupinda muchipset ecosystem ichishandisa yakamisikidzwa interface.

Intel yakaratidza kuti ichaisa mana Meteor Lake chipsets (anonzi "matairi / mataira" muIntel's parlance) pamusoro peiyo passive Foveros yepakati layer / base tile.Iyo base tile muMeteor Lake yakasiyana neiyo iri muLakefield, iyo inogona kutorwa seSoC neimwe nzira.3D Foveros yekurongedza tekinoroji inotsigirawo inoshanda yepakati layer.Intel inoti inoshandisa yakaderera-uye yakaderera-simba yakagadziridzwa 22FFL maitiro (yakafanana neLakefield) kugadzira Foveros interposer layer.Intel inopawo yakagadziridzwa 'Intel 16′ musiyano weiyi node kune ayo ekutanga masevhisi, asi hazvisi pachena kuti ndeipi vhezheni yeMeteor Lake base tile Intel ichashandisa.

Intel ichaisa compute modules, I/O blocks, SoC blocks, uye graphics blocks (GPUs) uchishandisa Intel 4 maitiro pane iyi yepakati layer.Ese aya mayuniti akagadzirwa neIntel uye anoshandisa Intel architecture, asi TSMC ichaita OEM iyo I / O, SoC, uye GPU zvidhinha mazviri.Izvi zvinoreva kuti Intel inongoburitsa iyo CPU uye Foveros zvidhinha.

Maindasitiri masosi anodonha kuti I / O inofa uye SoC inogadzirwa paTSMC's N6 maitiro, nepo tGPU inoshandisa TSMC N5.(Zvakakosha kuziva kuti Intel inoreva iyo I/O tile se'I/O Expander', kana IOE)

Manodhi emangwana paFoveros roadmap anosanganisira 25 uye 18-micron pitches.Intel inoti zvinotoita ne theory kuti uwane 1-micron bump spacing mune ramangwana uchishandisa Hybrid Bonded Interconnects (HBI).