Semicon Microcontroller Voltage regulator IC Chips TPS62420DRCR SON10 Electronic Components BOM list service

Packaging concept:

Nhete pfungwa: Maitiro ekuronga, kubatanidza, uye kubatanidza machipisi uye zvimwe zvinhu pafuremu kana substrate uchishandisa firimu tekinoroji uye microfabrication matekiniki, zvichitungamira kumaterminal nekuagadzirisa nekuputira neinogoneka insulating medium kuti iite yakazara matatu-dimensional chimiro.

Kunyatsotaura: maitiro ekubatanidza uye kugadzirisa pasuru kune substrate, kuiunganidza muhurongwa hwakakwana kana mudziyo wemagetsi, uye nekuona kushanda kwakazara kwehurongwa hwese.

Mabasa anowanikwa ne chip packaging.

1. kutamisa mabasa;2. kutamisa masaini edunhu;3. kupa nzira yekupisa kupisa;4. kuchengetedzwa kwemaitiro uye kutsigirwa.

Iyo tekinoroji level yekurongedza engineering.

Packaging engineering inotanga mushure mekunge IC chip yagadzirwa uye inosanganisira maitiro ese IC chip isati yanamirwa uye yakagadziriswa, yakabatana, yakavharidzirwa, yakavharwa uye yakachengetedzwa, yakabatana nebhodhi redunhu, uye sisitimu inounganidzwa kusvikira chigadzirwa chekupedzisira chapera.

Yekutanga nhanho: inozivikanwawo se chip level packaging, ndiyo maitiro ekugadzirisa, kubatanidza, uye kuchengetedza iyo IC chip kune yekurongedza substrate kana lead frame, ichiita iyo module (assembly) chikamu chinogona kutorwa nyore uye kutakurwa uye kubatana. kusvika pamwero unotevera wegungano.

Level 2: Maitiro ekubatanidza mapakeji akati wandei kubva padanho 1 nezvimwe zvinhu zvemagetsi kugadzira kadhi redunhu.Level 3: Maitiro ekubatanidza akati wandei makadhi edunhu akaunganidzwa kubva pamapakeji akapedzwa padanho 2 kugadzira chikamu kana subsystem pabhodhi guru.

Level 4: Maitiro ekuunganidza akati wandei ma subsystems kuita yakazara yemagetsi chigadzirwa.

Mu chip.Iyo nzira yekubatanidza yakasanganiswa yedunhu zvikamu pane chip inozivikanwawo sezero-level kurongedza, saka yekurongedza engineering inogonawo kusiyaniswa nematanho mashanu.

Classification yemapakeji:

1, zvichienderana nehuwandu hweIC chip mupakeji: single chip package (SCP) uye yakawanda-chip package (MCP).

2, maererano nekusiyaniswa kwezvinhu zvekuisa chisimbiso: polymer zvinhu (plastiki) uye ceramics.

3, zvinoenderana nemudziyo uye wedunhu bhodhi yekubatanidza nzira: pini yekuisa mhando (PTH) uye pamusoro pemhando yemhando (SMT) 4, zvinoenderana nepini yekuparadzira fomu: mapini ane mativi maviri, mapini ane mativi mana, uye pasi pini.

Zvishandiso zveSMT zvine L-mhando, J-mhando, uye I-mhando yesimbi mapini.

SIP: imwe-mutsara pasuru SQP: miniaturized pasuru MCP: simbi poto pasuru DIP: kaviri-mutsara package CSP: chip size package QFP: quad-sided flat package PGA: dot matrix package BGA: bhora grid array package LCCC: leadless ceramic chip carrier